Copper-filled trench contact for transistor performance improvement

ABSTRACT

Methods of fabricating a first contact to a semiconductor device, which fundamentally comprises providing a semiconductor device formed on a substrate. The substrate further includes a conductive surface. A dielectric layer is formed over the substrate and has an opening exposing the conductive surface. The opening extends an entire length of the semiconductor device, partway down the entire length of the device, extending from the device onto adjacent field of the device, or and a combination thereof. A barrier layer is formed within the opening. A copper containing material fills the opening to form a first contact to the semiconductor device.

This is a Divisional application of Ser. No. 11/396,201 filed May 23,2006, which is presently pending.

BACKGROUND

1. Field

Embodiments of the present invention relate to the fabrication ofinterconnect structures in microelectronic devices. In particular,embodiments of the present invention relate to utilizing copper to formcontact immediately to device formed on a semiconductor substrate.

2. State of the Art

The fabrication of microelectronic devices involves forming electroniccomponents on microelectronic substrates, such as silicon wafers. Theseelectronic components may include transistors, resistors, capacitors,and the like, with intermediate and overlying metallization patterns atvarying levels, separated by dielectric materials, which interconnectthe electrical components to form integrated circuits. The metallizationpatterns are generally referred to as “interconnects.”

One of the main issues confronting the semiconductor processing industryis that of the resistance problem in metallization layers. Anindustry-wide effort has undertaken to address the problem. Since thebeginning, the semiconductor processing industry has relied on aluminumand aluminum alloys to serve as metallization layers. Silicon dioxidewas selected as the insulator of choice although polyimide, a polymer,was used in a number of products by IBM for a number of years. With eachsucceeding generation of technology, the resistance problem grows.Because each generation requires that the dimensions of thesemiconductor structure be reduced, the minimum line-space combinationmust also decrease. As the line-space combination decreases, theresistance of the semiconductor structure increases.

Copper metallurgy has been proposed as a substitute for aluminummetallurgy as a material for the metallization layers since copperexhibits greater conductivity than aluminum. Yet several problems havebeen encountered in the development of copper metallurgy. The main issueis the fast diffusion of copper through an insulator, such as silicondioxide, to form an undesired copper oxide compound. Another issue isthe known junction-poisoning effect of copper. These issues have led tothe development of a liner to separate the copper metallization layerfrom the insulator.

Suitable liners include titanium nitride, tantalum nitride, tungstensilicon nitride, zirconium, hafnium, titanium, tantalum, and the like.

FIG. 1A illustrates a conventional semiconductor structure 100 (e.g., atransistor). The semiconductor structure 100 includes a substrate 102having formed therein isolation regions (Shallow Junction Isolation,STI) 104. Active or passive devices can be formed on the substrate 102.Such devices typically include source and drain regions 106, gatedielectric 112, gate electrode 114, spacers 110 and silicide surfaces108 and 116. As shown in FIG. 1B, to electrically connect to and fromthe device, contacts 120 (first contacts) are made to the device.Typically, several layers of interconnections are also made to connectto the first layer of contacts. An interlayer dielectric layer 118 isformed and patterned on the substrate 102. Through vias (or contactholes) are formed in the dielectric layer 118 to expose contact areas onthe substrate. Contact areas typically are source/drain regions and/oron top of the gate electrode 114. To establish/enhance the contactconnection, silicide layers 108 and 116 are formed on the surface ofthese regions as shown in FIGS. 1A-1B. The through vias are then filledwith tungsten (referred to as tungsten plug) to form the first level ofcontact to the device. In some applications, an additionally contact 122(or VIAO) formed in a dielectric layer 124 is also formed to connect thecontact or tungsten plug 120. The additional contact (or VIAO) 122 canbe filled with copper. Then, a plurality of metallization layer 130having dielectric material 126 and conductive lines 128 are formed ontop of the device.

Because of the undesirable characteristics of copper, copper has notbeen used in forming the first contact that is immediate to the device.However, as devices are scaled smaller and smaller, the high resistivitycharacteristic of the conductive material such as tungsten that istypically used in the first contact layer is becoming more undesirable.Tungsten causes parasitic resistance in the device by introducing highresistivity and low conductivity at the first contact level, at thejunction from the first contact level to other interconnection levels inthe devices. Thus, there is a need for a first layer of contact directlyto the device that will lower resistivity overall.

BRIEF DESCRIPTION OF THE DRAWINGS

While the specification concludes with claims particularly pointing outand distinctly claiming that which is regarded as the present invention,the advantages of this invention can be more readily ascertained fromthe following description of the invention when read in conjunction withthe accompanying drawings in which:

FIG. 1A-1B illustrates a conventional semiconductor device such as atransistor;

FIG. 2 illustrates an exemplary semiconductor device made according toembodiments of the present invention where a first contact to the deviceis formed with copper;

FIGS. 3A-1-3A-3 illustrates a top view of a first contacts made tosource/drains regions for the device shown in FIG. 2;

FIG. 3B-1 illustrates a three-dimensional view of a first contacts madeto a source/drains region for a conventional device;

FIG. 3B-2 illustrates a three-dimensional view of a row of first contactpillars made to a source/drain region for a conventional device;

FIG. 3C illustrates a three-dimensional view of a first contacts made toa source/drains region for a device according to embodiments of thepresent invention;

FIGS. 4A-4C illustrate an exemplary process flow of making asemiconductor device made according to embodiments of the presentinvention where a first contact to the device is formed with copper;

FIGS. 5A-5C illustrate another exemplary process flow of making asemiconductor device made according to embodiments of the presentinvention where a first contact to the device is formed with copper;

FIGS. 6A-6E illustrate yet another exemplary process flow of making asemiconductor device made according to embodiments of the presentinvention where a first contact to the device is formed with copper andwhere there is no prior silicide;

FIGS. 7-9 illustrate exemplary methods of making a semiconductor devicemade according to embodiments of the present invention where a firstcontact to the device is formed with copper with FIG. 7 illustrating amethod where no silicide is used, FIG. 8 illustrating a method withsilicide being used and FIG. 9 with silicide being forming through acontact opening.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENT

In the following detailed description, reference is made to theaccompanying drawings that show, by way of illustration, specificembodiments in which the invention may be practiced. These embodimentsare described in sufficient detail to enable those skilled in the art topractice the invention. Certain known processes are not described ordiscussed in details in order to not obscure the invention. It is to beunderstood that the various embodiments of the invention, althoughdifferent, are not necessarily mutually exclusive. For example, aparticular feature, structure, or characteristic described herein, inconnection with one embodiment, may be implemented within otherembodiments without departing from the spirit and scope of theinvention. In addition, it is to be understood that the location orarrangement of individual elements within each disclosed embodiment maybe modified without departing from the spirit and scope of theinvention. The following detailed description is, therefore, not to betaken in a limiting sense, and the scope of the present invention isdefined only by the appended claims, appropriately interpreted, alongwith the full range of equivalents to which the claims are entitled. Inthe drawings, like numerals refer to the same or similar functionalitythroughout the several views.

Embodiments of the present invention relate to the fabrication ofinterconnect structures in microelectronic devices. More particularly,embodiments of the present invention disclose the use of copper (Cu) inthe Front-End-Of-Line (FEOL) processing for a semiconductor device suchas a transistor. As is known, a semiconductor device is typically formedburied in the semiconductor substrate. What end up being exposed areusually contact regions for interconnecting the devices to othermetallization layers. Minimizing resistance from one interconnectionlevel to the next is desired for an efficient and optimal device.

Currently, copper is not used in the FEOL processing due to the hightendency of copper to diffuse through an insulator even though copperhas the desirable low resistivity and high conductivity characteristics.Copper can create copper oxide and disrupt the device. Copper can alsomigrate into the substrate, diffuse, and create both yield andreliability issues as it getters on dislocations or other interfaces.Because of such dangerous possibility, contacts immediately above thesurface of the semiconductor substrate or the device have been formedwith tungsten (W) to provide conductive interfaces or interconnection tothe device while preventing the diffusion of copper into the deviceareas. Copper is used in many metal layers in the Back-End-Of-Lineprocessing (e.g., dual damascene processing) to form metallizationlayers.

Fabrication of a semiconductor device includes two main process flows,FEOL and BEOL processes. In the FEOL process, wafer substrates aremarked, STI regions are formed, e.g., by implantation, P- and N-wellsare formed, e.g., by implantation, poly gate stacks are etched andformed, and source and drain regions are also formed by doping. Also,silicide layers or regions are also formed to enhance or establishconductive surfaces to the device. Also in the FEOL process, the firstcontact level is made to the device. The first contact levels typicallyinclude contacts to the source/drain regions and the gate electroderegion (or the respective silicide surfaces). In the BEOL process, thedevice and the associated contacts are interconnected to metallizationlayers including forming the metallization and dielectric layers. Copperhas been used in the BEOL process, e.g., dual damascene processing toform vias and trenches in the dielectric layers.

As mentioned, in conventional FEOL processing, tungsten is used for thefirst layer of contact. Embodiments of the present invention relate toforming the first layer of contact using copper. Additionally, theconventional FEOL processing has the first contacts being vertical thinlines (or pillars), referred to as “round contacts.” Embodiments of thepresent invention include forming the first contacts with “extendedinterconnect-style contacts” or “trench contacts” that haverectangular/square configurations. In one embodiment, a first contactextends the entire length of the contact region. In one embodiment, thefirst contact extends the entire length of the contact region andreplace a a set of conventional contact pillars. For example, the firstcontact to a source region would extend the entire length of the sourceregion. In other embodiments, the contact would extend only partiallydown the length of the contact region.

Embodiments of the present invention also pertain to using barrierlayers to encapsulate the first contact that is made of copper.Embodiments of the present invention also include forming a silicidelayer that can also act as a barrier layer and in some embodiments, thesilicide layer is a copper silicide layer. Embodiments of the presentinvention also reduce contact resistance from the first contact to thedevice, between the first contact and the silicide layer, and betweenthe first contact and other metallization layer above the first contact.

Embodiments of the present invention may enable better density scalingand cross-technology scaling by enabling optimal placement and alignmentflexibility in interconnection positioning. Additionally, with thetrench contact configuration, one device can be connected to anotherwithout going up to another metallization layer as is currently done inthe art. More importantly, the copper contacts provide reduction inparasitic resistance in the device by eliminating the conventionalcopper-to-tungsten junction and replacing it with copper-t-copperjunction from the device to the metallization layers. The resistivityreduction in the contacts and interconnection also enable moreconductivity, thus, better drive current in a device. Furthermore, theextended interconnect-style contact in the first contact level improvesdrive current by enhancing not just vertical conductivity but alsolateral conductivity since the contact extend more laterally compared toa conventional round-type contact. Thus, the conductivity to and fromthe device is increased, and in many cases, an increase of 30-45% drivecurrent have been observed with devices made in according to embodimentsof the present invention.

FIG. 2 illustrates an exemplary microstructure device 200 fabricatedaccording to embodiments of the present invention. The device 200 can bea transistor or capacitor or other semiconductor device. The device 200is formed on a semiconductor substrate 202 (e.g., a silicon wafer).Isolation regions such as STI 204 are formed in the substrate 202 toisolate one device from another as is known in the art. Source and drainregions 206 are also formed by doping into the substrate 202 as known inthe art. Between the source and drain regions 206 and on the top surfaceof the substrate 202, a gate dielectric 210 is formed. A gate electrode208 is formed on top of the gate dielectric 210. Contacts to the device200 can be made to the source and drain regions 206 and optionally, thegate electrode 208. The source/drain regions or gate electrode cansometimes be referred to as conductive surfaces so that the firstcontact can be made to the device 200. Often, a layer of silicidematerial 212 is formed over the source and drain regions 206 andoptionally, the gate electrode 208 to enhance the contact. The silicidelayer 212 can be formed as conventionally done. When silicide layer 212is include, the contact surfaces are the silicide surfaces. Spacersidewalls 218 are also disposed on each side of the gate electrode 208.

Contacts are made to the device. As referred herein, the first layer ofcontact refers to the contact that is made immediate to the device 200or on the top surface of the substrate 202 or as illustrated in FIG. 2(on top of the silicide layer 212). Thus, contacts are made to thesource/drain regions 206 and the gate electrode 208 (or their respectivesilicide layer formed thereon). In one embodiment, a dielectric layer216 is formed on the top surface of the substrate 202. Openings 201 areformed into the dielectric layer 216 and expose the silicide layer 212.In one embodiment, the silicide layer 212 lines the bottom of eachopening 201. In one embodiment, a barrier layer 214 lines the entiresurface (bottom surface and sidewalls) of the opening 201 as shown inFIG. 2. The openings 201 are then filled with copper to form the firstcontact 220 using methods such as deposition, sputtering,electroplating, or electroless plating. In one embodiment, a seed layer(not shown) is also used to line the opening and on top of the barrierlayer 214 to promote the adhesion of the copper or to promote nucleationof copper to form the first contact 220. In one embodiment, a viaconnector 222 is formed that connects to the first contact 220. In oneembodiment, the via connector 222 and the opening 201 are filled in asingle operation. The via connector 222 is then interconnected to one ormore metallization layers (MT1 to MT8) 226 above. Methods such as dualdamascene processing can be used to form the via connector 222 and themetallization layers MT1-MT8. Interlevel dielectric layers are also usedat each metallization layer as is known in the art.

In more particular, the terms wafer and substrate used in the followingdescription include any base semiconductor structure. Both are to beunderstood as including silicon-on-sapphire (SOS) technology,silicon-on-insulator (SOI) technology, thin film transistor (TFT)technology, doped and undoped semiconductors, epitaxial layers ofsilicon supported by a base semiconductor structure, as well as othersemiconductor structures well known to one skilled in the art.Furthermore, when reference is made to a wafer or substrate in thefollowing description, previous process steps may have been utilized toform regions/junctions in the base semiconductor structure and layerformed above, and the terms wafer or substrate include the underlyinglayers containing such regions/junctions and layers that may have beenformed above. The following detailed description is, therefore, not tobe taken in a limiting sense, and the scope of the present invention isdefined only by the appended claims.

The silicide layer 212 can be formed using a conventional method such asdepositing a conductive material (e.g., using chemical vapor deposition)on the top surface of the source/drain regions 206 or the gate electrode208 and then anneal the structure to form the silicide material. In oneembodiment, the silicide layer 212 comprises any metal that is capableof reacting with silicon to form metal silicide. Examples of such metalsinclude Ti, Ta, W, Co, Ni, Pt, Pd and alloys thereof. The silicide layer212 may be deposited using a conventional deposition process includingchemical vapor deposition, physical vapor deposition, sputtering,evaporation, chemical solution deposition, plating, and the like. Tocomplete the silicide layer formation, the structure is annealed toconvert the silicide metal layer 212 into a metal silicide. Theannealing is typically done at a temperature from about 600-3000° C. Aninert gas (e.g., helium, argon, and nitrogen) may be presence during thesilicide annealing.

The dielectric layer 216 includes a substance that comprises a materialselected from a group consisting of a polymer, a foamed polymer, afluorinated polymer, a fluorinated-foamed polymer, an aerogel, and aninsulator oxide compound. The polymer includes polyimide. The insulatoroxide compound may include silicon dioxide, silicon nitride, carbondoped oxide, fluorinated silicon oxide, boron/phosphorous doped oxide,and the like. The dielectric layer 216 can be formed using aconventional method such as chemical vapor deposition, evaporation,atomic layer deposition, or chemical solution deposition.

Vias 201 may be formed into the dielectric layer 216 using methods knownin the art, e.g., etching, photolithography, lithography, ion milling,laser ablation, damascene, dual damascene, and the like. The vias 201are opening formed in the dielectric layer 216 and extending into thedielectric layer. In one embodiment, the vias 201 have a trench-likeconfiguration or an extended interconnect-style configuration as opposedto the conventional thin vertical line via.

The barrier layer 214 is formed to prevent diffusion of the copper atomsinto the dielectric layer 216. This diffusion changes the microstructureof a portion of the device 200 and causes undesired effects. The barrierlayer 214 can be formed using conventional methods. The barrier layer214 can be thin and in one embodiment, less than 100 Å. In otherembodiments, barrier layer 214 is less than 20 Å, less than 15 Å, andeven less than 10 Å along the sidewalls of the opening 201 andoptionally, along all surfaces of the opening 201. In one embodiment,the barrier layer 214 is made of a material that can both act as adiffusion barrier for the interconnect material (such as acting as adiffusion barrier for copper and copper alloys) and act as anactivation/nucleation layer for the interconnect material to formthereon (such as acting as a seed layer for the copper to form).

Materials that can be used as a barrier layer include but are notlimited to ruthenium (Ru), paladium (Pd), rhodium (Rh), nickel (Ni),cobalt (Co), and platinum (Pt), titanium (Ti), tantalum (Ta), titaniumnitride (TiN), TaN, WsiN, Zr, hafnium (Hf), tungsten (W), etc. A portionof the barrier layer 214 may also extend over and abut the surface ofdielectric layer 216.

In one embodiment, a seed layer (not shown) is deposited on the barrierlayer 214 prior to the deposition of the copper to form the firstcontact 220. A low-energy ion implantation can be used to form the seedlayer. In one embodiment, depositing the seed layer includes depositinga copper seed layer. In one embodiment, depositing the seed layerincludes depositing copper seed layer having a thickness of less than100 Angstroms. This can be achieved using an 8×10¹⁶ ion implantation ofcopper. In one embodiment, the energy of implantation includes about 100electron-volts. Additionally, the copper seed layer can also beimplanted at an angle normal to the planarized surface.

The seed material may be deposited in a chemical vapor deposition (CVD)process, an atomic layer deposition (ALD) process or a physical vapordeposition (PVD) process, such as magnetron sputtering, but is not solimited. The seed material provides a nucleation site for a subsequentelectroless plating process for the copper. The seed material mayinclude, but is not limited to, copper (Cu), palladium (Pd), cobalt(Co), nickel (Ni), ruthenium (Ru), platinum (Pt), alloys thereof, andthe like.

In one embodiment, copper is electrolessly deposited into the via 201 toform the first contact 220. The electroless deposition process mayinclude any autocatalytic (e.g., no external power supply is applied)deposition of the conductive material layer through the interaction of ametal salt and a chemical reducing agent. As is known in the art,preparing or treating a surface, may be necessary in order to produce anactivated surface so that the surface that is receptive to theelectroless deposition process.

In one embodiment, during the electroless deposition, the seed materialserves as the activated surface upon which the electroless depositionforms. The seed material also acts as a region which controls theplacement of the deposited copper from the electroless depositionsolution only deposits on the prepared or treated surface (e.g., theseed material).

In one embodiment, the electroless plating bath or deposition solutionmay comprise cobalt and alloys thereof (such as cobalt alloyed withtungsten, boron, phosphorus, molybdenum, and/or the like), nickel andalloys thereof (such as nickel alloyed with tungsten, boron, phosphorus,molybdenum, and/or the like), copper, palladium, silver, gold, platinummetals and their selective alloys to fill narrow and high aspect ratiotrenches and via holes. It is, of course, understood that theelectroless deposition solution may also include additives (such assuppressors, polyethylene glycol, and anti-suppressors, di-sulfide) andcomplexing agents (such as thiosulfate and peroxodisulfate). Although afew examples of materials that may comprise the electroless depositionsolution are described here, the solution may comprise other materialsthat serve to deposit the conductive material electrolessly. Thetechnique of electrolessly depositing a metal or metal alloy is known tothose skilled in the art, and may be performed either by immersing thesubstrate in an electroless deposition solution, by semi-immersion, orby spraying the electroless deposition solution onto the substrate ortarget (e.g., the dielectric material layer 216). It is well known tothose skilled in the art that the seed material may be subsumed duringthe electroless deposition process, such that the seed material maybecome continuous with the conductive material.

In one embodiment, the contact 220 is planarized after the copper fillsthe vias 201, usually by a technique called chemical mechanical polish(CMP) or by an etching process, which removes the copper, which is notwithin the opening 201.

In one embodiment, via connector 222 are formed to electricallyinterconnect to the first contact 220. A conventional BEOL process canbe used to form the via connector 222. For example, a dual damascenemethod can be used to form the via connector 222. The via connector 222connects to the metallization layers 226, which can also be formed usingsimilar methods. In an alternative embodiment, the copper deposited inthe opening to form the first contact 220 is etched or otherwise removedin a way to leave the via connector 222 extending from the first contact220. In one embodiment, the first contact 220 and the via connector 222are filled simultaneously with copper. It is to be noted that dualdamascene process is not the only technique that can be used to form thefirst contact 220 and the via connector 222. Conventional metal etchingmethods can be used to form the first contact 220 and the via connector222, sequentially or simultaneously.

FIGS. 3A-1 to 3A-3 describe in more details an exemplary embodimentwhere the first contact has a configuration of an extendedinterconnect-style contact as opposed to the conventional round via orline of vias (in other words, a conventional vertical pillar; or line ofpillars) contact shown in FIG. 3B-1 and FIG. 3B-2. In the presentembodiment (FIG. 3A-1), the first contact 220 extends an entire lengthof the source and drain regions 206. Similarly, the first contact 220that is formed over the gate electrode 208 may also extend the entirelength of the gate electrode 208. It is to be understood that in manydevices, the first contact 220 does not extend the entire length of thesource and drain regions or that the first contact 220 extends a lengthsufficient to allow electrical interconnection to the device (FIG.3A-2). In one embodiment, the first contact 220 has a rectangularconfiguration as shown in FIGS. 3A-1 to 3A-3.

FIG. 3A-1 illustrates the device 200 from a top view with the source anddrain regions 206 and the gate electrode 208 showing. The silicide layer212 is not shown for clarity purpose. In one embodiment, the opening 201is formed so that the opening 201 extend an entire length L101 of thesource/drain regions 206. In one embodiment, the opening 201 extends anentire length of the device. In other embodiments, the opening 201extends down a fraction of the device as shown in FIG. 3A-2. In yetother embodiments, the opening 201 extends a fraction of the device andthen extend larger to meet the via connector 222 as shown in FIG. 3A-3.While FIGS. 3A-1 and 3A-2 show the top view of the device FIG. 3A-3shows the cross-sectional side view for clarity purposes.

The via connector 222 needs not be placed entirely over the firstcontact 220. As shown in FIGS. 3A-1 and 3A-2, the via connector 222 isplaced partially in contact with and only partially over the firstcontact 220. Similarly, the first metallization layer MT1 226 needs notbe placed entirely over the first contact 220 or the via connector 222.As shown in FIG. 3A-1, the metallization layer MT1 226 is placedpartially in contact with and only partially over the via connector 222and/or the first contact 220.

FIG. 3B-1 illustrates the configuration of a conventional via contact(e.g., device 100). Here, a source/drain region 106 and a dielectriclayer 118 formed over the source/drain region are shown. The via has aconfiguration of a cylindrical tube (or pillar) and as such, often iscalled “round contact.” The conventional via is typically only a thinvertical conductive line forming through the dielectric layer andconnecting to the contact region (e.g., source/drain region) as shown inFIG. 3B-1. The conventional via can be implemented as a single pillar(as in FIG. 3B-1) or a line of pillars (as in FIG. 3B-2) On the otherhand, in one embodiment, the first contact 220 made according toembodiments of the present invention has the configuration of arectangular contact or trench contact as shown in FIG. 3C (in a threedimensional view).

The extended configuration or trench contact configuration for the firstcontact 220 enables flexibility in circuit design and placement of theinterconnecting elements. For example, the trench contact need not runthe entire length of the source drain region, and (because of the highconductivity of the contact due the the Cu fill) can also extendsignificantly beyond the edge of the source drain region. The viaconnector 222 needs not be placed directly over the region of thesubstrate 202 where the device is formed (“field region”) but instead,can be placed toward the side where space is available and still able tointerconnect to the first contact 220. Additionally, filling the trenchcontact with copper may be easier than filling a round via contact withcopper. Furthermore, the extended first contact filled with copperreduces vertical resistivity as well as lateral resistivity; and, beingfilled with copper, the first contact further optimizes drive current byproviding optimal vertical and lateral conductivity. In one embodiment,a device built using the extended-interconnect style first contact has a10-15% conductivity improvement over the conventional round style firstcontact.

FIGS. 4A-4C illustrate an exemplary process flow and correspondingstructures throughout the process of making a semiconductor device 400during a FEOL according to embodiments of the present invention. Asubstrate 402 is provided. The substrate 402 has a set of isolationregions 404 formed therein. Source and drain regions 406 are also formedin the substrate. A gate dielectric 408 is formed on the top surface 410of the substrate 402. A gate electrode 412 is formed on top of the gatedielectric layer 408. Typically, the gate electrode 412 and the gatedielectric are referred to as a gate stack. Spacers 414 are also formedon each side of the gate stack.

In one embodiment, (FIGS. 4A-4B), a silicide layer is formed over thecontact regions of the device and in the present example, a silicidelayer 416 is formed over the source/drain regions 416 and the gateelectrode 412. In one embodiment, to form the silicide layer 416, aconductive metal is deposited and the structure is annealed to convertthe metal and the top portion of the substrate into metal silicide. Thesilicide layer 416 is resistant to etching, is conductive, and behaveslike a semiconductor crystal. The silicide layer 416 thus provides aconductive surface on a silicon surface. A dielectric layer 418 isformed over the surface 410 and patterned to form opening 420 as shownin FIG. 4B. In one embodiment, the opening 420 each extend the entirelength of the device 400. Alternatively, the opening 420 only extendsdown part of the device. In either the case of a full extension or apartial extension, the opening may extend beyond the device over theadjacent field. For example, the opening 420 extends into the page andcovers the entire length of the device 400 that extends into the page.An etch stop layer (not shown) may be used to prevent etching ordamaging to the silicide layer 416 during the opening 420 formationprocess.

Alternatively, the dielectric layer 418 is formed over the substrate 402(over the top surface 410) prior to the silicide layer 416 formation.The dielectric layer 418 is then etched to form the opening 420. Then,the silicide layer 416 is formed inside each of the opening 420.

In FIG. 4C, a barrier layer 422 is formed and lined the opening 420. Inone embodiment, the barrier layer 422 (e.g., TaN) is formed inconjunction with an oxygen plasma treatment applied to the barrier layer422 to improve its barrier performance.

Copper is then deposited into the opening 420 to form the first contact424. In one embodiment a seed layer is not used. In such embodiment, thebarrier layer 422 is made of a material that is capable of beingactivated to be a nucleated site for the copper to form thereon. In oneembodiment, electroless plating is used to deposit the copper. Inanother embodiment, electroplating is used to deposit the copper. Whenthe device 400 is completed, at this point, the FEOL may be consideredfinished and the BEOL begins to form other interconnection layers to thedevice 400. For example, via connectors and metallization layers areformed to connect to the first contact 424 using methods known in theart.

FIGS. 5A-5C illustrate an exemplary process flow similar to FIGS. 4A-4Cwith the addition of a seed layer 506 (e.g., a copper seed layer) beingdeposited on top of the barrier layer 422.

FIGS. 6A-6E illustrate another exemplary process flow of making asemiconductor device 600 during a FEOL according to embodiments of thepresent invention. A substrate 602 is provided. The substrate 602 has aset of isolation regions 604 formed therein. Source and drain regions606 are also formed in the substrate. A gate dielectric 608 is formed onthe top surface 610 of the substrate 602. A gate electrode 612 is formedon top of the gate dielectric layer 608. Typically, the gate electrode612 and the gate dielectric 608 are referred to as a gate stack. Spacers614 are also formed on each side of the gate stack.

In one embodiment, (FIGS. 6A-6B), a dielectric layer 618 is formed overthe substrate 602 (over the top surface 610). At this point, unlike thedevice 400, no silicide layer is formed. The dielectric layer 618 isthen etched to form the opening 620. In one embodiment, the opening 620each extend the entire length of the device 600. Alternatively, theopening 620 only extends down part of the device. In either the case ofa full extension or partial extension, the opening may extend beyond thedevice over the adjacent field. For example, the opening 620 extendsinto the page and covers the entire length of the device 600 thatextends into the page.

FIG. 6C, a barrier layer 622 is formed and lined the opening 620. In oneembodiment, the barrier layer 622 is also formed to provide anadditional function much like that of a metal silicide layer. Thebarrier layer 622 thus contains a metal or a conductive material thatwill react with the silicon surface and form a conductive surfacesimilar to a conventional metal silicide. Further, the barrier layer 622is made of material that inhibits diffusion of the copper into thedielectric layer 618. Examples of such metal include TaN, TaN(O), WN,tantalum, cobalt, nickel, and copper. In one embodiment, the barrierlayer 622 (e.g., TaN or WN) is formed in conjunction with an oxygenplasma treatment applied to the barrier layer 622 to improve its barrierperformance. The barrier layer 622 is also subjected to annealing sothat the metal component in the barrier layer 622 can form metalsilicide. It is to be noted herein that only the portion of the barrierlayer 622 that lies above the source/drain region or on top of a siliconcontaining surface such as the source and drain region that a silicidelayer is formed. Specifically, a portion of the barrier layer 622 isconverted into silicide where the barrier layer 622 material is formedover the silicon. In one embodiment, copper is deposited and immediatelyannealed to form copper silicide which then allow the copper silicide toact as a barrier layer 622 with conductivity characteristic that of ametal silicide. FIG. 6D illustrates the bottom portion 622-B of thebarrier layer 622 converting into a silicide portion after the barrierlayer 622 is treated. The barrier layer 622 thus has a portion 622-Bthat transforms into a silicide layer in addition to the rest of thebarrier layer 622 being a diffusion barrier for copper.

FIG. 6E shows copper being deposited into the opening 620 to form thefirst contact 624. In one embodiment a seed layer is not used. In suchembodiment, the barrier layer 622 is also made of a material that iscapable of being activated to be a nucleated site for the copper to formthereon. In one embodiment, electroless plating is used to deposit thecopper. In another embodiment, electroplating is used to deposit thecopper. When the device 600 is completed, at this point, the FEOL may beconsidered finished and the BEOL begins to form other interconnectionlayers to the device 600. For example, via connector and metallizationlayers are formed to connect to the first contact 624 using methodsknown in the art. In an alternative embodiment, a copper seed layer isdeposited on top of the barrier layer 622 prior to the deposition of thecopper through electroplating or electroless plating.

FIG. 7 illustrates an exemplary method 700 of forming a contact to asemiconductor device (e.g., during a FEOL process). At 702, a substratehaving a contact device (e.g., a transistor) formed thereon is provided.At 704, a dielectric layer is formed immediately above the top surfaceof the semiconductor device. At 706, an opening (having a trench likeconfiguration or a rectangular configuration) is formed into thedielectric layer to expose a contact region (e.g., source/drain region)immediately above the top surface of the semiconductor device. Theopenings can extend the entire length of the device, for example, theopenings exposing the source/drain regions extend the entire length ofthe source/drain regions. Alternatively, the opening only extends downpart of the device. In either the case of a full extension or a partialextension, the opening may extend beyond the device over the adjacentfield. At 708, the opening is lined with a barrier layer such that thebarrier liner covers the exposed contact region to prevent diffusion ofa material such as copper that will be used to fill the opening. At 710,the opening is filled with the conductive material or copper.

FIG. 8 illustrates an exemplary method 800 of forming a first contact toa semiconductor device (e.g., during a FEOL process). At 802, asubstrate is provided. Isolation trench, source/drain regions, gatestack and spacers are also formed in or on the substrate. At 804, asilicide layer is formed over the source/drain regions and optionally,the gate electrode layer of the gate stack. At 806, a dielectric layeris formed immediately above the top surface of the semiconductor device.Openings (having a trench like configuration or a rectangularconfiguration) are formed into the dielectric layer to expose thesource/drain regions and optionally, the gate electrode region. Theopenings can extend the entire length of the device, for example, theopenings exposing the source/drain regions extend the entire length ofthe source/drain regions. Alternatively, the opening only extends downpart of the device. In either the case of a full extension or a partialextension, the opening may extend beyond the device over the adjacentfield. At 808, the opening is lined with a barrier layer such that thebarrier liner covers the exposed contact region to prevent diffusion ofa material such as copper that will be used to fill the opening. At 810,a seed layer is optionally formed on top of the barrier layer toinitiate nucleation for the formation of the copper in the openings. At812, the openings are filled with the conductive material or copperusing electroplating or electroless plating.

FIG. 9 illustrates an exemplary method 900 of forming a first contact toa semiconductor device (e.g., during a FEOL process). At 902, asubstrate is provided. Isolation trench, source/drain regions, gatestack and spacers are also formed in or on the substrate. At 904, adielectric layer is formed immediately above the top surface of thesemiconductor device. Openings (having a trench like configuration or arectangular configuration) are formed into the dielectric layer toexpose the source/drain regions and optionally, the gate electroderegion. The openings can extend the entire length of the device, forexample, the openings exposing the source/drain regions extend theentire length of the source/drain regions. Alternatively, the openingonly extends down part of the device. In either the case of a fullextension or a partial extension, the opening may extend beyond thedevice over the adjacent field. At 906, a metal is added to permitformation of a silicide on the exposed silicon region. Using processingknown in the art, the metal is annealed and a silicide layer is formedover the source/drain regions and optionally, the gate electrode layerof the gate stack. The opening is optionally lined with a barrier layersuch that the barrier liner covers the exposed contact region to preventdiffusion of a material such as copper that will be used to fill theopening. At 910, a seed layer is optionally formed on top of the coppersilicide layer to initiate nucleation for the formation of the copper inthe openings. At 912, the openings are filled with the conductivematerial or copper using electroplating or electroless plating.

Embodiments of the present invention permit more flexibility in theplacement of via connector and/or metalizations to a device whileproviding superior performance over conventional configuration ofinterconnection to a device. For instance, in one embodiment, (as thestate of the art or conventional devices with round contacts does noteven permit this configuration) a via connector such as the viaconnector 222 is located adjacent to the device on the adjacent fieldand connects to the device through the extension of a first contact suchas the contact 220 onto the field. In this configuration the highconductivity of the trench contact style for the first contact providessignificant performance improvement. Experimental results from devicesfabricated with copper-contacts in this exemplary configuration show forNMOS up to 35% Idsat and 50% IDlin improvement, and for PMOS up to 30%Idsat and 50% IDlin improvement; when compared to conventional Wprocessing in the same geometry. If the W processing is enhanced to thelimit of the state of the art (i.e. configurations unrealistic for massproduction), improvements are still seen for NMOS up to 15% Idsat and25% IDlin improvement, and for PMOS up to 10% Idsat and 20% IDlinimprovement; when compared to conventional W processing in the samegeometry.

Although embodiments above focus mainly on FEOL processing, the same canbe applied to BEOL processing without exceeding the scope of theembodiments of the present invention.

Having thus described in detail embodiments of the present invention, itis understood that the invention defined by the appended claims is notto be limited by particular details set forth in the above description,as many apparent variations thereof are possible without departing fromthe spirit or scope thereof.

1. A semiconductor assembly comprising: a silicon containing substrate;a semiconductor device formed thereon; a conductive surface on a topsurface of the semiconductor device; a dielectric layer formed on thetop surface having an opening exposing the conductive surface, theopening extending one of an entire length of the semiconductor device,partway down the entire length of the device, extending from the deviceonto adjacent field of the device, and a combination thereof; a barrierlayer lining surfaces of the opening; and a copper containing materialfilled the opening forming a first contact to the semiconductor device.2. The semiconductor assembly of claim 1, wherein said barrier layer iscapable of acting as a diffusion barrier layer and a nucleation surfacefor copper.
 3. The semiconductor assembly of claim 1 further comprises,a seed layer formed on top of the barrier layer prior to the coppercontaining material filling the opening.
 4. The semiconductor assemblyof claim 1, wherein the barrier layer comprises copper silicide.
 5. Thesemiconductor assembly of claim 1 further comprises a via connector madewith copper and contacting at least a portion of the first contact. 6.The semiconductor assembly of claim 5, wherein the via connector isplaced outside a field of the semiconductor device.
 7. The semiconductorassembly of claim 5 further comprises, one or more metallization layersinterconnected to the first contact.
 8. The semiconductor assembly ofclaim 1, wherein the semiconductor device comprises a source and drainregions and a gate electrode, and wherein each of the source and drainregions and the gate electrode includes a contact surface.